| 摘要 |
PROBLEM TO BE SOLVED: To reduce the reflection loss of high-frequency signals in the joint between the center conductor of a coaxial connector and the line conductor of a circuit board to which the center conductor is connected. SOLUTION: A package for housing semiconductor element is provided with a substrate 1 having a mounting section 1a for mounting a semiconductor element 5, a frame 2 having an attaching section 2a for the holding member 11 of the coaxial connector 3 in its side section, and the holding member 11 having an inserting hole 11b for inserting the connector 3. The package is also provided with the coaxial connector 3 and the circuit board 6 on which the line conductor 6b is formed to electrically connect the semiconductor element 5 to the center conductor 3b of the connector 3. The insulating substrate 6a of the circuit board 6 has a low dielectric section 6d in which the dielectric constant in an area below the joint of the line conductor 6b with the center conductor 3b is made lower than that in the other area. Consequently, the reflection loss of high-frequency signals can be reduced by suppressing the fluctuation of the characteristic impedance at the joint between the conductors 6b and 3b. COPYRIGHT: (C)2004,JPO |
