| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing, having good non-halogen non-antimony flame resistance and excellent in moldability, such as fluidity and adhesiveness, and low hygroscopic property, and to provide an electronic component device comprising an element sealed with the material. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) a cyclophosphazene compound represented by general formula (I), (D) an inorganic filler and (E) an ion-exchanger, wherein the compounding amount of the (C) ingredient makes phosphorus atom amount 0.5-5 wt.% based on the total amount of compounded ingredients except the inorganic filler (D) and the compounding amount of the (D) ingredient is≥70 wt.% based on the epoxy resin molding material for sealing. [In general formula (I), one or two of X<SP>1</SP>to X<SP>6</SP>is hydroxy and others are H.] The electronic component device comprises an element sealed with the epoxy resin molding material for sealing. COPYRIGHT: (C)2004,JPO
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