发明名称 Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
摘要 A method of coating a semiconductor substrate material with a coating material consisting of the steps of mixing an adhesion promoter with a coating material and applying the mixture to a semiconductor substrate material. The invention also includes means for coating a semiconductor substrate material with a coating material comprising means for mixing adhesion promoters with coating materials and means for applying the mixture of adhesion promoters and coating materials to a semiconductor substrate.
申请公布号 US2004097097(A1) 申请公布日期 2004.05.20
申请号 US20030696825 申请日期 2003.10.30
申请人 JEANS ALBERT HUA;MEI PING 发明人 JEANS ALBERT HUA;MEI PING
分类号 G03F7/085;C09D175/04;G03F7/16;H01L21/027;H01L21/312;(IPC1-7):H01L21/31 主分类号 G03F7/085
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