HEAT SEALABLE POLYPROPYLENE-BASED RESIN COMPOSITION

摘要

PURPOSE: A heat sealable polypropylene-based resin composition is provided, to improve a heat sealing property and to suppress the generation of low crystalline materials, thereby enhancing the blocking resistance of films. CONSTITUTION: The polypropylene-based resin composition comprises 80-98 wt% of a crystalline ethylene-propylene-1-butene terpolymer having a melt index of 1.0-10.0 g/10 min (230 deg.C) and a melting point of 125-135 deg.C; 1-10 wt% of a 1-butene-alpha-olefin copolymer having a melt index of 1.0-10.0 g/10 min (230 deg.C) and a density of 0.89-0.91 g/cm¬3; and 1-10 wt% of an ethylene-propylene random block copolymer having a melt index of 1.0-10.0 g/10 min (230 deg.C) and a melting point of 140-150 deg.C. Preferably the 1-butene-alpha-olefin copolymer contains an alpha-olefin of C2-C8; and the ethylene-propylene random block copolymer comprises 80-95 wt% of a crystalline ethylene-propylene copolymer containing 1-5 wt% of ethylene and 5-20 wt% of an elastic ethylene-propylene copolymer containing 25-60 wt% of ethylene.