发明名称 Keraaminen monikerrossubstraatti ja menetelmä sen valmistamiseksi
摘要 A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.
申请公布号 FI20030580(A) 申请公布日期 2004.05.20
申请号 FI20030000580 申请日期 2003.04.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD., 发明人 JUN,SEOK TAEK;LEE,YOUNG KEUN;CHOI,IK SEO
分类号 H01G4/12;H01G4/252;H01G4/30;H01L23/498;H05K1/03;H05K1/14;H05K3/00;H05K3/24;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K 主分类号 H01G4/12
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