| 摘要 |
PURPOSE: A silica grinding wheel is provided to be capable of manufacturing an abrasive made of colloidal silica alone without using a bond for minimizing the surface contamination and damage of a wafer. CONSTITUTION: An abrasive of a silica grinding wheel is made of silica. Preferably, the grinding wheel is manufactured by sintering the abrasive without bonding material. Preferably, the sintering is performed at the temperature of 850-950 °C. Preferably, the grain diameter of the abrasive is in the range of 300-1000 nm. Preferably, the wafer contamination and damage caused by using the bonding material is considerably reduced.
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