| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a high-output light-emitting chip by improving the radiation efficiency using a lead frame. <P>SOLUTION: The light emitting device has a box-type frame 1 that is made of an insulating material and has a space inside the frame, a lead frame fixed to the frame, and a light emitting chip 11 fixed to the lead frame. A rising portion 9 is formed on the lead frame, which is located within a sidewall of the frame or along an inner-wall surface of the sidewall. The lead frame includes a first lead frame for fixing the light emitting chip and a second lead frame connected to the chip by wire bonding, and the rising portion is formed at least on the first lead frame. <P>COPYRIGHT: (C)2004,JPO |
