HEAT TRANSFER METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a cooling method for an electronic assembly such as a semiconductor chip by using a thin layer of a liquid metal with a high conductivity. SOLUTION: The liquid metal 18 is preferably gallium, or its alloy, that conducts heat from a chip 14 to a heat sink or a heat dissipation section 16. This system has more than one aperture part 38 that allows the filling of a liquid and evacuation of a space occupied by the liquid. The system also uses a flexible seal like a film held to a proper place by an O ring or a retaining ring, or a plug that seals the filling aperture part. The seal is flexible so that it deals with the expansion and contraction of the liquid as well as a phase change from a liquid phase to a solid phase. COPYRIGHT: (C)2004,JPO