| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device, which transfer conductive particles surely and at a high speed to the semiconductor device. SOLUTION: This apparatus comprises a vessel to contain the conductive particles, a stirring means for stirring the conductive particles in the vessel by air or an inert gas flow, and a mounting jig for mounting the conductive particles. This structure allows the supply of the conductive particles by the use of the air or the inert gas flow to be carried out at high speed. Moreover, since mechanical force is not applied to the conductive particles, damages to the conductive particles are prevented. COPYRIGHT: (C)2004,JPO
|
