DICING METHOD, COVER GLASS, LIQUID CRYSTAL PANEL, LIQUID CRYSTAL PROJECTOR, IMAGING DEVICE, AND DIGITAL IMAGE RECOGNITION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dicing method which is not affected by edge abrasion of a dicing blade, a cover glass processed by the method, a liquid crystal projector using the cover glass, a solid state imaging device equipped with the cover glass and a digital image recognition device equipped with the solid state imaging device. SOLUTION: A base substrate 10 is cut off by following three dicing steps in total; forming an intermediate dicing trench 32 in a taper trench 31 after forming the taper trench 31 or performing a chamfering after forming the intermediate dicing trench 32, and forming a cut-dicing trench 35 to get through the intermediate dicing trench 32 from the opposite side. Alternatively, the base substrate 10 is cut off by following three dicing steps in total; forming the intermediate dicing trench 32, forming the taper trench 31 on the surface opposite to the side where the intermediate dicing trench 32 is formed, and forming the cut-dicing trench 35 in the taper trench 31 to get through the intermediate dicing trench 32. COPYRIGHT: (C)2004,JPO