| 摘要 |
A magnetron sputtering apparatus and a magnetron sputtering method using the same, wherein a vacuum chamber has a discharge gas inlet and a discharge gas outlet, a substrate holder is installed inside the vacuum chamber, a magnetic circuit unit, which includes a target electrode installed opposite to the substrate and a magnetron fixed on a rear surface of the target electrode, faces the substrate holder and circulates around the central axis of the substrate holder, and a driving unit circulates the magnetic circuit unit and adjusts a distance between the target electrode and the center of the substrate holder. Accordingly, in the magnetron sputtering apparatus of the present invention, the uniformity of a thin film and the step coverage is improved.
|
