发明名称 |
Lid for use in packaging an electronic device and method of manufacturing the lid |
摘要 |
A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10-500 mum and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip. |
申请公布号 |
US2004094320(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20030614350 |
申请日期 |
2003.07.08 |
申请人 |
GOTO MASAAKI;NISHIUCHI FUMIAKI;NAKAJIMA MISAO;ZEN MITSUO;TANIGUCHI SANAE;AZUMA TAKENORI |
发明人 |
GOTO MASAAKI;NISHIUCHI FUMIAKI;NAKAJIMA MISAO;ZEN MITSUO;TANIGUCHI SANAE;AZUMA TAKENORI |
分类号 |
H01L23/02;H01J5/00;H01L23/04;H01L23/10;H01L23/28;H01L41/02;H03H9/02;H03H9/10;(IPC1-7):H01J5/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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