| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with which a photosensitive resist film can be formed by using a dipping method and a fine high-density conductive circuit be obtained by an etching process, and to provide a method for manufacturing a printed wiring board having a fine high-density conductive circuit by using the above composition. <P>SOLUTION: The photosensitive resin composition comprises: a resin soluble with an alkali aqueous solution and having 5,000 to 200,000 average molecular weight and 20 mgKOH/g to 300 mgKOH/g acid value; an addition polymerizable unsaturated compound having at least two ethylenically unsaturated double bonds in the molecule; a photopolymerization initiator; and a solvent. <P>COPYRIGHT: (C)2004,JPO |
