| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic circuit from disrupting the stability of actuation due to wiring resistance on a substrate. SOLUTION: A substrate 12 has electrodes facing liquid crystals. An IC chip 13 packaged on the substrate 12 is provided with the electronic circuit 134 for impressing a driving voltage to the electrodes. Also, the IC chip 13 has a packaging surface 13A which is provided with terminals and faces the substrate 12 and a conduction surface 13B which is conducted to part of the electronic circuit 134. Wiring 125 for external connection formed on the substrate 12 is connected to the terminals disposed on the packaging surface 13A of the IC chip. In the meantime, the wiring board 20 has a wiring 25 connected to the conduction surface 13B of the IC chip 13. The wiring 25 is formed of material having the resistivity lower than the resistivity of the wiring 125. COPYRIGHT: (C)2004,JPO |
