| 摘要 |
PROBLEM TO BE SOLVED: To prevent a deformation defective in a bump terminal caused by contact failure of the bump terminal with a test electrode, and caused by irregular contact of the bump terminal with the test electrode. SOLUTION: In this testing method for testing semiconductor devices 16 arrayed with the plurality of bump terminals 13 on an terminal face, the plurality of semiconductor devices 16 with the terminal face directed upwards is stored in a semiconductor device storage tray 10, the bump terminals 13 of the semiconductor devices 16 stored in the semiconductor device storage tray 10 are position-regulated with respect to the tray 10, the storage tray 10 is moved to arrange the respective bump terminals 13 of the plurality of semiconductor devices 16 stored in the semiconductor device storage tray 10 into prescribed testing positions in order, and the semiconductor devices 16 are thereafter tested respectively. COPYRIGHT: (C)2004,JPO
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