| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for conducting a highly reliable test for a wiring board. SOLUTION: A temporary wiring device for inspection is mounted on the wiring board 10 of an inspecting object instead of a semiconductor integrated circuit for display control, each inspection probe is brought into contact with each signal line of the wiring board 10, and it is arranged in a test furnace 45. An inspection signal generated in an inspection circuit 32 is impressed to the each signal line under this condition to measure a voltage and a current. The wiring board 10 is laid under a condition near to an actual operation by making a waveform of the inspection signal the same as a waveform in the actual operation. A temperature of the test furnace 45 is raised to conduct the reliability test under the condition near to an actual operation. COPYRIGHT: (C)2004,JPO
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