摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which is capable of shortening a tact time when a substrate is subjected to a drying process after the substrate is processed with a processing solution. SOLUTION: The substrate processing apparatus is equipped with a first cassette 16 where the unprocessed substrates are housed, a second cassette 17 which houses the substrates that are subjected to a drying process after they are processed with a processing solution, a spinning/processing device 1 which processes the substrates with a processing solution and then dries them up, a loading/unloading robot 8 which unloads the unprocessed substrates from the first cassette 16 to load them into the spinning/processing device 1 and unloads the undried substrates that are halfway through a drying process from the spinning/processing device 1, and a heating lamp 14 which dries up the substrates while the unprocessed substrates are unloaded from the spinning/processing device 1 and transferred to the second cassette 17. COPYRIGHT: (C)2004,JPO
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