发明名称 |
METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for forming a capacitor of a semiconductor device is provided to restrain the damage of a dielectric layer due to a heat treatment for preventing the increase of leakage current by using a deterioration preventing layer. CONSTITUTION: A mold insulating layer is formed on a substrate having a contact plug. A storage node hole is formed on the mold insulating layer for exposing the contact plug. A capacitor lower electrode layer is formed on the resultant structure. A deterioration preventing layer is formed on the lower electrode layer. A storage node separation process is performed by partially removing the deterioration preventing layer and the lower electrode layer. Then, the deterioration preventing layer is selectively removed from the storage node hole for remaining only at the bottom portion of the storage node hole. A dielectric layer is deposited on the resultant structure. A capacitor upper electrode is formed on the dielectric layer.
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申请公布号 |
KR20040042185(A) |
申请公布日期 |
2004.05.20 |
申请号 |
KR20020070354 |
申请日期 |
2002.11.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, SUK JIN;KIM, WAN DON;YOO, CHA YEONG |
分类号 |
H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8242 |
代理机构 |
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地址 |
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