发明名称 ULTRASONIC WELDING METHOD FOR RESIN PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an ultrasonic welding method for a resin package which reduces the damage of the resin package while performing highly accurate positioning when ultrasonic welding is performed. <P>SOLUTION: In the method for forming the resin package by ultrasonically welding the bonding surfaces of both of a resin case 1 and a cover 10, two positioning pins 5 capable of being broken by ultrasonic vibration are integrally formed to the bonding surface 4 of the case 1 and positioning holes 14, in which the positioning pins 5 are pressed and fitted, are formed to the bonding surface 13 of the cover 10. The positioning pins 5 are pressed and filled in the positioning holes 14 and ultrasonic vibration, of which the amplitude is larger than the fitting gap between each of the positioning pins 5 and each of the positioning holes 14, is applied to the case 1 and the cover 10 in the direction almost parallel to the bonding surfaces 4 and 13 of the case 1 and the cover 10 while pressing the case 1 and the cover 10 in an opposed direction not only to break the positioning pins 5 but also to weld the bonding surfaces 4 and 13. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004142136(A) 申请公布日期 2004.05.20
申请号 JP20020306882 申请日期 2002.10.22
申请人 MURATA MFG CO LTD 发明人 SAKAI RYOSUKE;KITANI AKIHIRO
分类号 B29C65/08;B29C65/78;H01L23/02;H01L23/08 主分类号 B29C65/08
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