PHOTOSENSITIVE FILM, PRINTED WIRING BOARD PROVIDED THEREWITH, AND METHOD FOR PRODUCING THE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive film having flexibility enough to level the unevennesses of a pattern circuit and giving itself smoothness after leveling the unevennesses, to provide a printed wiring board provided with the film, and to provide a method for producing the printed wiring board.

SOLUTION: The photosensitive film essentially comprises a base polymer and preferably contains a (meth)acrylic compound. This film has a thickness of 1-60μm, being formed so as to cover a pattern circuit having unevennesses with heights corresponding to 50-95% of the film thickness; in this case, this film levels the pattern circuit, resulting in that the level difference for unevennesses on the reverse face of the pattern circuit's leveled surface is ≤5μm.

COPYRIGHT: (C)2004,JPO