发明名称 |
SOLDER WITHOUT LEAD AND COUPLING WITHOUT LEAD |
摘要 |
PROBLEM TO BE SOLVED: To provide a solder which does not contain lead or harmful substance and has an excellent electric characteristics and to provide a coupling which does not contain lead. SOLUTION: The solder which does not contain lead but contains zinc and tin has a liquid phase temperature of≥260°C. The solder contains≤5wt.% nickel and≤0.5wt.% aluminum. Alternatively, the solder which has the liquid phase temperature of≥260°C contains 30 to 70wt.% zinc,≤5wt.% nickel and the balance tin. Further, the coupling using the solder without lead is provided. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004141926(A) |
申请公布日期 |
2004.05.20 |
申请号 |
JP20020309549 |
申请日期 |
2002.10.24 |
申请人 |
KOA CORP;SORUDAA KOOTO KK;OKABE GIKEN KK |
发明人 |
KOBAYASHI HIROSHI;KATO KAZUYUKI;SUGIURA MASAHIRO;OKABE SABURO |
分类号 |
B23K35/26;B23K35/28;C22C13/00;C22C18/00;C23C2/06;H05K3/34;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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