| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of enhancing the uniformity of the thickness of the main surface conductive layer and the back surface conductive surface in the wiring board which comprises a product part and a frame part, and a method for manufacturing the wiring board. SOLUTION: In a wiring board 101, a conductor area rate in the main surface first frame conductive part 130 is equal to the conductor area rate of the main surface product conductive part 127, and the conductor area rate of the back surface first frame conductive part 150 is equal to the conductor area rate of the back surface product conductive part 147. Further, since the conductor area rate of the main surface second frame conductive part 131 is greater than the conductor area rate of the back surface product conductive part 147, a conductor area ratio of the back surface side third conductive layer 145 to the main surface side third conductive layer 125 is smaller than the conductor area ratio of the back surface product conductive layer 147 to the main surface product conductive part 127. COPYRIGHT: (C)2004,JPO
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