| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board which is hardly warped, excellent in insulating properties, and superior in flexibility and evenness. SOLUTION: A solder resist layer is manufactured through: a pattern electrode forming process of forming a pattern electrode having a prescribed shape on a conductive tentative board; a master board forming process of bonding the pattern electrode on a board; a releasing layer forming process of forming a releasing layer on the surface of the master board; an electrodeposition process of forming a polyimide film on the surface of the releasing layer on the master board by applying a voltage to the pattern electrode in a polyimide deposition solution; and a release/transfer process of superimposing the polyimide film of the master board on the surface of the wiring board where an interconnect line is provided, releasing the polyimide film from the master board, and transferring the polyimide film onto the surface of the wiring board to form the polyimide solder resist layer. The flexible wiring board is manufactured through the above manufacturing method of the solder resist layer. COPYRIGHT: (C)2004,JPO
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