| 摘要 |
PROBLEM TO BE SOLVED: To provide electrolytic polishing composition which applies electrolytic current to polish a work-piece made of copper or copper alloy at a high speed even at a low polishing pressure without melting a metal layer to be polished during electrolytic polishing. SOLUTION: This electrolytic polishing composition (electrolytic liquid EL) is used for electrolytic polishing to make flat a metal layer to be polished, which is provided on a printed circuit board and is made of copper or copper alloy. This composition is solved in water and ionized to form an electrolyte, which gives conductivity to an aqueous solution, and a metallic complex body, which reacts to the metal of a metal layer, is weaker in mechanical strength than the metal, and is hard to be solved in water. The aqueous solution includes water soluble chelating agent and anticorrosives, which forms a protective film on the surface of the metal, and the electrolyte includes a first electrolyte and a second electrolyte, which has the same or higher degree of dissociation as that of the first electrolyte and keeps the gloss of the surface of the metal layer constant by assisting the complex formation reaction due to chelating agent. COPYRIGHT: (C)2004,JPO
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