发明名称 HEAT INSULATION PANEL FOR FLOOR HEATING
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive heat insulation panel for hot water type floor heating reduced in its thickness. SOLUTION: In this heat insulation panel 1 for floor heating, provided with pipe grooves 10 (10a, 10b, 10c) on an upper surface of a heat insulation base 2, vacuum heat insulation members 12 (12a, 12b, 12c) having heat insulating effect higher than that of the heat insulating base 2, are buried in only a part of the heat insulation base 2 opposite to the hot water pipe 3, at a lower part of the hot water pipe 3, when the hot water pipes 3 (3a, 3b, 3c) are placed in the pipe grooves 10. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004144340(A) 申请公布日期 2004.05.20
申请号 JP20020307445 申请日期 2002.10.22
申请人 RINNAI CORP 发明人 KONO SHUYU;IWATA TAKESHI
分类号 F24D3/16;(IPC1-7):F24D3/16 主分类号 F24D3/16
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