发明名称 |
Bond surface conditioning system for improved bondability |
摘要 |
Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).
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申请公布号 |
US2004093725(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20030611480 |
申请日期 |
2003.07.01 |
申请人 |
MALOLEPSZY SEAN MICHAEL;SAKAKINI PETER J. |
发明人 |
MALOLEPSZY SEAN MICHAEL;SAKAKINI PETER J. |
分类号 |
C09J5/02;C23F1/00;H01K3/10;H01L21/31;H01L21/44;H01L21/48;H01L21/607;H01L21/66;(IPC1-7):C09J5/02 |
主分类号 |
C09J5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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