发明名称 |
IRRADIATION REGION CONTROLLING UNIT FOR WAFER EXPOSURE APPARATUS |
摘要 |
PURPOSE: An irradiation region controlling unit for a wafer exposure apparatus is provided to easily remove particles of a blade part by using an exhaust part. CONSTITUTION: An irradiation region controlling unit(9) is provided with a blade part(91) for controlling a light irradiated region of a wafer and an exhaust part(98) connected with the blade part for exhausting particles from the blade part to the outside. The light irradiated to the wafer is transmitted from a light source through a plurality of optical systems. The irradiation region controlling unit further includes a cooling part(96) for cooling the blade part by supplying cooling gas. Preferably, the cooling gas is exhausted through the exhaust part by installing the exhaust part and the cooling part at both sides of the blade part, respectively.
|
申请公布号 |
KR20040041779(A) |
申请公布日期 |
2004.05.20 |
申请号 |
KR20020069656 |
申请日期 |
2002.11.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JEONG HWAN |
分类号 |
H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|