| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanically stabilized pad in a thermally conductive interface pad formed by dispersing a quantity of a liquid metal and thermally conductive particulates into a polymer matrix. SOLUTION: A stabilized thermally conductive mechanically compliant laminate pad is provided, which comprises upper and lower laminae on opposed surfaces of a central stabilizing apertured grid, wherein portions of the both laminae extend through the apertures of the grid to form a continuum. The laminae contains a mixture of a polymer matrix, a quantity of a low-melting indium or gallium containing alloy having a melting point at about 120°C, and the thermally conductive particulates solid dispersed therein. The grid structure forms about 10% to 90% of the area for the mesh grid region while the balance is the apertures. Each of the reticulated apertures has a cross-sectional dimension greater than about 0.5 mil. The polymer matrix is composed of a rigid resin having a melting point ranging between about 40°C and 120°C. COPYRIGHT: (C)2004,JPO |
