发明名称 SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide substrate treatment equipment wherein maintainability can be improved. SOLUTION: The substrate treatment equipment is provided with a reaction tube which accommodates substrates and treats them, and in which a substrate holder retaining the plurality of substrates in multiple steps is inserted and the treatment is performed; and a heating means which surrounds the reaction tube and heats the substrates in the reaction tube. In the equipment, an exhaust port 20 which exhausts the atmosphere between the inside of the heating means and the outside of the reaction tube, and an exhaust pipe connected with the exhaust port 20, are arranged at a position higher than the heating means, and a cooling means which is arranged in the exhaust pipe and cools the discharge object in the pipe is arranged. The exhaust pipe is provided with at least a first exhaust pipe connected with the exhaust port 20 and a second exhaust pipe connected with the cooling means, and bonding/decouple of the first and the second exhaust pipes is performed with a driving mechanism, so that need for removing the piping in the conventional equipment is excluded, and the cooling means can be separated from a treatment furnace by operating a driving control device of an air cylinder 106 from a controller for controlling the whole substrate treatment equipment. As a result, high altitude working of operators becomes unnecessary, safety characteristics of the operators are improved, and the maintenance time is shortened due to simplification of removal working of the treatment furnace so that the throughput is improved. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146509(A) 申请公布日期 2004.05.20
申请号 JP20020308387 申请日期 2002.10.23
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKEBAYASHI MOTONARI;ISHII AKINORI
分类号 C23C16/455;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/455
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