发明名称 FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To improve the quality of a film, and to improve film deposition efficiency. SOLUTION: The system comprises a cylindrical can along the circumferential face of which a film-like body to be treated runs and which consists of a cylindrical part 101 and flanges 102 and 103, and is provided with a cooling mechanism for cooling the running face of the body to be treated in the cylindrical part 101. The cylindrical part 101 and the flanges 102 and 103 are formed of a material whose thermal expansion coefficient is≤5.0×10<SP>-6</SP>/°C. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004143520(A) 申请公布日期 2004.05.20
申请号 JP20020309086 申请日期 2002.10.24
申请人 SONY CORP 发明人 HIKICHI TOSHIO
分类号 C23C14/56;C23C16/54;G11B5/84;G11B5/85;(IPC1-7):C23C14/56 主分类号 C23C14/56
代理机构 代理人
主权项
地址