发明名称 High density DRAM with reduced peripheral device area and method of manufacture
摘要 A dynamic random access memory (DRAM) structure having a distance less than 0.14 um between the contacts to silicon and the gate conductor is disclosed. In addition a method for forming the structure is disclosed, which includes forming the DRAM array contacts and the contacts to silicon simultaneously.
申请公布号 US2004094810(A1) 申请公布日期 2004.05.20
申请号 US20020294329 申请日期 2002.11.14
申请人 INFINEON TECHNOLOGIES NORTH AMERICA CORP. 发明人 MALDEI MICHAEL;COUSINEAU BRIAN;GERSTMEIER GUENTER;BERRY JON S.;BAKER STEVEN M.;LEE JINHWAN
分类号 H01L21/336;H01L21/82;H01L21/8234;H01L21/8242;H01L27/10;H01L29/40;H01L29/739;H01L29/76;H01L29/78;(IPC1-7):H01L29/76 主分类号 H01L21/336
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