| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a singulated substrate can be eliminated, because the dimensional classification of the singulated substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured easily. <P>SOLUTION: This method of manufacturing resistor includes a step of forming a first resist layer 27 on the upper surface of a sheet-like insulating substrate 21 so as to cover protective layers 24 and 26 and, at the same time, a second resist layer 28 on the rear surface of the substrate 21, and a step of forming a plurality of slit-like first split sections 29 for dividing the substrate 21 into a plurality of strip-like substrates by separating a plurality of pairs of upper-surface electrode layers 22. This method also includes a step of forming a plurality of pairs of side-face electrode layers 30 on the internal surfaces of the first split sections 29 by electroless plating the insulating substrate 21 containing the split sections 29 with nickel, and a step of patterning the side-face electrode layers 30 by peeling the first and second resistor layers 27 and 28 from the substrate 21. <P>COPYRIGHT: (C)2004,JPO</p> |
