| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can reduce transmission loss at a desired frequency, a build-up board, and a manufacturing method of the printed wiring board. <P>SOLUTION: This printed wiring board is equipped with a multilayer board 1, a via hole 3 which penetrates the multilayer board 1, a surface-layer wiring 2 which is provided on the surface layer of the multilayer board 1 and is connected to one end 6 of the via hole 3, at least one inner layer wiring 4 which is provided in the multilayer board 1 and is connected to any point of the conductive portion (excluding the upper and lower ends) of the via hole 3, and a conductive member 9 which is connected to the other end 7 (opposite to the end 6 to which the surface-layer wiring 2 is connected). The conductive member 9 has such an electrical length that the impedance value obtained at a predetermined frequency when the conductive member 9 is viewed from a connection point 8 between the inner layer wiring 4 and the conductive portion of the via hole 3, which is the nearest to the end 7, becomes greater than the impedance value obtained when the end 7 is viewed from the connection point 8 in the case where the conductive member 9 is absent. <P>COPYRIGHT: (C)2004,JPO</p> |
