| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring substrate for bonding a semiconductor chip or a bumped electrode and a pad electrode on a wiring substrate firmly without storing a semiconductor chip bumped electrodes in a non-oxidizing ambient atmosphere or also without removing the oxide film or contamination on the surface of the pad electrode. <P>SOLUTION: The manufacturing method of a multilayer wiring substrate includes: a step of forming a bump electrode on a first wiring substrate; a step of forming a pad electrode on a second wiring substrate; a step of attaching metallic particulate on an end of the bump electrode; and a step of locating the first wiring substrate and the second wiring substrate oppositely, pressing while the pad electrode is put in contact with the bump electrode having the end, to which the metallic particulate is attached, and joining the pressed part by heating. <P>COPYRIGHT: (C)2004,JPO</p> |
