METHOD FOR MANUFACTURING MICROSTRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a microstructure having thin wall sections formed with high accuracy with respect to thickness dimensions. SOLUTION: The method includes a step (b) of forming the thin wall sections by subjecting a material substrate having a laminated structure including a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulation layer 104 which has pattern shapes including areas for masking the thin wall section points to be worked to the thin wall sections in the second conductor layer 102 and is interposed between the first conductor layer 101 and the second conductor layer 102 and a second insulation layer 105 which has the pattern shapes including the thin wall section points in the second conductor layer 102 in the mask region and is interposed between the second conductor layer 102 and the third conductor layer 103 to etching treatment from the first conductor layer 101 side down to the second insulation layer 105 through the mask patterns 58 including the points corresponding to the thin wall section points in the non-mask region. COPYRIGHT: (C)2004,JPO