CONTACTLESS IC CARD, AND MANUFACTURING METHOD OF AND MANUFACTURING DEVICE FOR CONTACTLESS IC CARD

摘要

PROBLEM TO BE SOLVED: To provide a contactless IC card and a contactless IC card manufacturing method and manufacturing device that can suppress burrs and chips of an adhesive material layer on card punching faces and increase the flatness of card surfaces.

SOLUTION: An inner core sheet material 32C laminated on a chip mounting surface of an antenna module 36 via adhesive 33C is disposed in the adhesive material layer 33 interposed between facing sheet materials 32A and 32B and embedded with the antenna module 36. The area ratio of the adhesive material layer 33 in the punching faces 31s is reduced to suppress burrs and chips of the adhesive material layer 33 in punching. The quantity of adhesive used to constitute the adhesive material layer 33 can be reduced to prevent flatness degradation of the card surfaces due to curing shrinkage of the adhesive and to accommodate a rewrite function sufficiently.

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