| 发明名称 |
PERFORATION PROCESSING METHOD FOR CERAMIC GREEN SHEET |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the following problems: a part of an article to be processed becomes a molten state at the time of processing when a ceramic green sheet is subjected to perforation processing by a laser to be left around a processed perforation as an adherend, a structural flaw is yielded in the periphery of a via-electrode after lamination and baking and the connection reliability of the via-electrode or the moisture resistance of a device is not obtained. <P>SOLUTION: The pulse output shape of a laser beam 2 has a rectangular approximate shape and the ceramic green sheet 3 is irradiated with a high peak/short pulse type laser beam wherein the minimum value of processing energy is not less than 60% of the maximum value of the processing energy. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004142138(A) |
申请公布日期 |
2004.05.20 |
| 申请号 |
JP20020306927 |
申请日期 |
2002.10.22 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAITO RYUICHI;MITA TSUNEHISA;SAEKI HIDEFUMI;KATSUMURA HIDENORI |
| 分类号 |
B23K26/00;B23K26/06;B23K26/18;B23K26/38;B23K26/40;B23K101/36;B28B11/12;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):B28B11/12 |
主分类号 |
B23K26/00 |
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