| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To highly accurately measure an error of a pattern position of a mask. <P>SOLUTION: The measuring method uses an aligner. The method comprises a step for simultaneously photographing a mark M1 formed on the mask 30 and a mark WP1 formed on a pallet 44 on which a wafer 40 is mounted by a microscopic image pickup device 150 having two image forming optical systems which can be focused on respective marks M1, WP1, a step for measuring a relative positional deviation between the mark M1 and the mark WP1 on the basis of obtained mark image signals, a step for simultaneously photographing a mark M2 on the other position and the mark WP1, a step for measuring a relative positional deviation between the mark M2 and the mark WP1 on the basis of respective obtained mark image signals, and a step for finding out an error of the pattern position of the mask on the basis of a pallet moving distance L and the measured positional deviations. <P>COPYRIGHT: (C)2004,JPO</p> |
