| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a SAW (surface acoustic wave) chip the productivity of which is enhanced as maintaining high quality, its manufacturing method and a manufacturing method of a surface-mounted SAW device by preliminarily forming an airtight space which surrounds a functional part of the SAW chip on the side of the SAW chip by a photolithography process in the SAW device with structure that the SAW chip is mounted on a surface-mounted substrate at a face-down state. SOLUTION: The SAW chip is provided with a piezoelectric substrate 2, a functional part 3 consisting of a conductive pattern formed on a main surface of the piezoelectric substrate, a connection pad 4 connected with the functional part, high dam parts 5 projected on the main surface of the piezoelectric substrate so that each of the external surfaces of the functional part and the connection pad is surrounded, respectively, a resin layer 6 laminated on the top surface of each of the dam parts and openings of circular dam parts which surrounds the functional part are hermetically sealed by the resin layer. COPYRIGHT: (C)2004,JPO
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