发明名称 Thermal treatment equipment and method for heat-treating
摘要 The invention provides a method for activating impurity element added to a semiconductor and performing gettering process in shirt time, and a thermal treatment equipment enabling to perform such the heat-treating. The thermal treatment equipment comprises treatment rooms of n pieces (n>2) performing heat-treating, a preparatory heating room, and a cooling room, and heating a substrate using gas heated by heating units of n pieces as a heating source, wherein a gas-supplying unit is connected to a gas charge port of the cooling room, a discharge port of the cooling room is connected to a first gas-heating unit through a heat exchanger, a charge port of an m-th (1<=m<=(n-1)) treatment room is connected to a discharge port of an m-th gas-heating unit, a charge port of an n-th treatment room is connected to a discharge port of an n-th gas-heating unit, a discharge port of the n-th treatment room is connected to the heat exchanger, and discharge port of the heat exchanger is connected to gas charge port of the preparatory heating room.
申请公布号 US2004096797(A1) 申请公布日期 2004.05.20
申请号 US20030706357 申请日期 2003.11.12
申请人 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/324;F28D15/00;F28F1/26;(IPC1-7):F27D1/00 主分类号 H01L21/324
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