发明名称 POLISHING APPARATUS, POLISHING WORK CARRIER, AND POLISHING METHOD OF WORK
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of preventing a polishing work carrier from sticking to a surface plate for polishing. <P>SOLUTION: The polishing apparatus 1 comprises a work carrier 30A whose upper surface has a work retention hole 33, and a surface plate for polishing whose lower surface is set to be a polishing machining surface. Then, the polishing apparatus 1 allows the upper surface of a work being loaded in the work retention hole 33 of the carrier 30A for retaining and the lower surface of the surface plate for polishing to slide for polishing the work. After polishing, the surface plate for polishing is alienated upward to the work. A sticking prevention hole 34 is provided on the upper surface of the carrier 33. The sticking prevention hole 34 prevents the carrier 30A from sticking to the lower surface of the surface plate for polishing when the surface plate for polishing is alienated upward to the work. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146471(A) 申请公布日期 2004.05.20
申请号 JP20020307599 申请日期 2002.10.22
申请人 SHOWA DENKO KK 发明人 NISHIKIDO TAKANORI;MATACHI HIDEO;KUSHINO TAKAHIRO
分类号 B24B37/27;B24B37/28;H01L21/304 主分类号 B24B37/27
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