| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of being fired at ≤1,050°C and forming a wiring layer containing a low resistant metal by simultaneous firing, and having high installation reliability. <P>SOLUTION: In the wiring board possessing an insulation substrate and the wiring layer, a glass-ceramic sintered compact obtained by mixing 60-99 mass% glass powder containing at least 30-55 mass% SiO<SB>2</SB>, 15-40 mass% Al<SB>2</SB>O<SB>3</SB>, 3-25 mass% MgO, 2-15 mass% ZnO and 2-15 mass% B<SB>2</SB>O<SB>3</SB>with 1-40 mass% filler powder of at least one kind selected from the group of mullite, anorthite, slawsonite, celsian and quartz glass, molding the mixture and firing the molded product in the air or a nitrogen atmosphere at ≤1,050°C is used as the insulation substrate. <P>COPYRIGHT: (C)2004,JPO |
