发明名称 CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition which has excellent high temperature rigidity, excellent heat resistance, excellent flowability, and an excellent balance between conductivity and high speed surface impact strength at low temperature. <P>SOLUTION: This conductive resin composition comprising (A) a polyamide, (B) polyphenylene ether, (C) an impact-improving material, and (D) a conductive filler is characterized by being obtained through a process for melting and kneading the component (B), the component (C) and the component (D), a process for melting and kneading the obtained composition and all or a part of the component (A), and a process for melting and kneading the obtained composition and the component (D), wherein the amount of the component (D) in the process is <50wt.%, when the total amount of the component (D) is 100wt.%. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004143238(A) 申请公布日期 2004.05.20
申请号 JP20020307829 申请日期 2002.10.23
申请人 ASAHI CHEMICAL CORP 发明人 MIYOSHI TAKAAKI;HASHIMOTO KAZUHIKO
分类号 C08J3/20;B29B7/00;B29K71/00;B29K77/00;B29K105/00;C08J3/22;C08K7/02;C08L71/12;C08L77/00;H01B1/00;H01B1/24;H01B5/16;H01B13/00 主分类号 C08J3/20
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