| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, adhesiveness, resolution, chemical resistance, mechanical strength, peeling characteristics, flexibility, and solubility or dispersibility with a developer liquid. <P>SOLUTION: The photosensitive resin composition contains: (A) a binder polymer; (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in the molecule; and (C) a photopolymerization initiator. As for the component (A), the composition contains acrylates, methacrylates or their derivatives expressed by formula (1), wherein R1 represents a hydrogen atom or a methyl group, R2 represents a 4-36C alkyl group or a 4-36C long-chain substituent. The composition is useful to increase the density and resolution of a printed wiring board. <P>COPYRIGHT: (C)2004,JPO |
