发明名称 COOLING DEVICE FOR ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a fluid-driven cooling device suitable for a thin and flat structure and high in operational reliability with respect to the increase of heat generating amount of a heating element, which is accompanied by the improvement of performance of an electronic apparatus. <P>SOLUTION: The cooling device 3 is constituted by providing a flat chamber 4 provided with an oscillator 5 on at least one surface of the same, with a port 6 having a tapered part and the wider side of the opening area of the tapered part connected to the outer side of the chamber. Another port 7 is connected to the inner side of the chamber. Cooling fluid is driven by the cooling device 3 to radiate the heat of the heating element 2. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004146547(A) 申请公布日期 2004.05.20
申请号 JP20020309105 申请日期 2002.10.24
申请人 HITACHI LTD 发明人 OHASHI SHIGEO;HIRASAWA SHIGEKI;NAKANISHI MASATO
分类号 G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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