| 摘要 |
PROBLEM TO BE SOLVED: To appropriately and quickly determine a position for performing each inspection to efficiently inspect film thickness or CMP machining residue in a wafer, through hole machining remainder, and the like in an inspection method of a thin-film device and a manufacturing method of a semiconductor device. SOLUTION: In the method for inspecting the film thickness of an optically transparent thin film formed on the surface of the thin-film device during the manufacturing process of the thin-film device, a position for managing the film thickness of the optically transparent thin film is preset. The film thickness of the optically transparent thin film at the set position is obtained by detecting the reflection light of light applied to the thin film, and the obtained film thickness value is compared with a preset management value, thus inspecting the film thickness of the optically transparent thin film, and hence automatically setting appropriate inspection conditions without requiring any skill. Additionally, by using this sort of method enables an appropriate process management andan improvement in yields and throughput. COPYRIGHT: (C)2004,JPO |
