| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module capable of preventing cracks from occurring by reducing stress concentration resulting from a difference in each member's thermal expansion generated in a bottom face of a groove through temperature change occurring when a cooler or a package and an Si substrate are soldered together in the optical module. SOLUTION: There is provided the optical module comprising a semiconductor laser element, a lens for converting light emitted from the semiconductor laser element, the substrate mounting these parts, the cooler mounting the Si substrate, and the package for housing the cooler. The optical module includes the groove having any one of shapes among V, trapezoidal and rectangular shapes. The shape of a metalized film in the backside of the Si substrate connected to the package can be formed in a location by avoiding a location corresponding to the bottom face of the groove and further avoiding at least one side of a lateral face in an optical axial direction of a location corresponding to the bottom face of the groove. COPYRIGHT: (C)2004,JPO
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