发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which has an excellent balance between conductivity and high speed surface impact strength at low temperature and an excellent fracture mode at surface impact fracture. SOLUTION: This conductive resin composition comprising (A) a polyamide, (B) polyphenylene ether, (C) an impact-improving material, and (D) a conductive filler is characterized by melt-kneading a part of the component (A), a part of the component (B), a part of the component (C), and a part or all of the component (D) to form the preliminary mixture and then melt-kneading the preliminary mixture, the residual (A), (B) and (C) components, and, if necessary, the component (D). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004143241(A) 申请公布日期 2004.05.20
申请号 JP20020307832 申请日期 2002.10.23
申请人 ASAHI CHEMICAL CORP 发明人 MIYOSHI TAKAAKI;TERADA KAZUNORI
分类号 C08J3/20;B29B11/06;B29B11/14;C08K3/04;C08L71/12;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08J3/20
代理机构 代理人
主权项
地址