发明名称 |
THIN FILM MAKING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin film making apparatus which suppresses contamination of discharge surfaces of electrodes. <P>SOLUTION: The thin film making apparatus is provided with a discharge space arranged to oppose the first electrode and the second electrode, a voltage applying means for iapplying a high-frequency voltage between the first electrode and the second electrode, and a gas introducing means for introducing reactive gas and discharge gas to the discharge space and making film to a substrate surface arranged on the second electrode by applying the voltage to the electrodes from the voltage applying means under the atmospheric pressure or the pressure near the atmospheric pressure thereby activating the reactive gas introduced into the discharge space. The discharge gas contains gaseous nitrogen of 50 to 100vol% and prevents direct contact of the discharge surface of the first electrode with the reactive gas. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004143568(A) |
申请公布日期 |
2004.05.20 |
申请号 |
JP20020312559 |
申请日期 |
2002.10.28 |
申请人 |
KONICA MINOLTA HOLDINGS INC |
发明人 |
KONDO YOSHIKAZU;MIZUNO KO;FUKAZAWA KOJI |
分类号 |
H05H1/24;B01J19/08;C08G83/00;C08J7/06;C23C16/455;H01L21/205 |
主分类号 |
H05H1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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