发明名称 THIN FILM MAKING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin film making apparatus which suppresses contamination of discharge surfaces of electrodes. <P>SOLUTION: The thin film making apparatus is provided with a discharge space arranged to oppose the first electrode and the second electrode, a voltage applying means for iapplying a high-frequency voltage between the first electrode and the second electrode, and a gas introducing means for introducing reactive gas and discharge gas to the discharge space and making film to a substrate surface arranged on the second electrode by applying the voltage to the electrodes from the voltage applying means under the atmospheric pressure or the pressure near the atmospheric pressure thereby activating the reactive gas introduced into the discharge space. The discharge gas contains gaseous nitrogen of 50 to 100vol% and prevents direct contact of the discharge surface of the first electrode with the reactive gas. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004143568(A) 申请公布日期 2004.05.20
申请号 JP20020312559 申请日期 2002.10.28
申请人 KONICA MINOLTA HOLDINGS INC 发明人 KONDO YOSHIKAZU;MIZUNO KO;FUKAZAWA KOJI
分类号 H05H1/24;B01J19/08;C08G83/00;C08J7/06;C23C16/455;H01L21/205 主分类号 H05H1/24
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