| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a singulated substrate can be eliminated, because the dimensional classification of the singulated substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured easily. <P>SOLUTION: This method includes a step of forming a plurality of slit-like first split sections 28 in a sheet-like substrate 21 for dividing the substrate 21 into a plurality of strip-like substrates by separating a plurality of pairs of upper-surface electrode layers 22, and a step of forming side-face electrode layers 29 on the rear surface of the insulating substrate 21 in which the first split sections 28 are formed and the internal surfaces of the first split sections 28 by sputtering. This method also includes a step of patterning the side-face electrode layers 29 by peeling a resist layer 27 formed on the rear surface of the insulating substrate 21 from the substrate 21. <P>COPYRIGHT: (C)2004,JPO</p> |
